Electroninks to present silver MOD inks at TechBlick 2026

Electroninks will host a booth and present at TechBlick 2026 on June 10-11 in Mountain View, California, highlighting how silver MOD inks could improve conductivity, lower curing temperatures and reduce material use in advanced electronics. The session comes as manufacturers look for better performance and cost control amid silver price volatility.

Why it matters: - Silver MOD inks are positioned as a potential alternative to conventional silver particle-based conductive pastes used in printed electronics and advanced manufacturing. - The technology aims to deliver dense conductive films with less silver content, which could improve production economics when silver prices fluctuate. - Lower curing temperatures and broader substrate compatibility could make the inks useful for plastic-based and next-generation electronics manufacturing.

What happened: - Electroninks said it will host a booth and present a session at TechBlick 2026 on June 10-11 at the Computer History Museum in Mountain View, California. - Mitchell Smith, engineer and product manager at Electroninks, will present “Silver MOD Inks: Advancing Performance Beyond Particle Pastes” at 12:15 p.m. PT on June 10. - Electroninks invited attendees to visit Booth E07 at the event.

The details: - The presentation will examine metal organic decomposition, or MOD, inks as a next-generation alternative to silver particle-based conductive pastes. - The session will explain how MOD inks differ from traditional particle-filled formulations at the chemical level. - Mitchell Smith said the market is reaching a point where performance, scalability and cost efficiency must evolve together. - Smith said MOD inks offer a different chemical approach that enables denser conductive films, lower curing temperatures and broader substrate compatibility. - The presentation will outline four claimed benefits of silver MOD inks: denser conductive films than conventional silver particle pastes, high electrical performance with reduced metal loading, lower-temperature curing for plastic substrates and support for additive manufacturing and printed electronics. - The session is aimed at manufacturers, materials engineers and product developers using conductive particle pastes or evaluating conductive inks for future products. - Electroninks says its proprietary MOD ink platform is expanding across advanced packaging, additive electronics, EMI shielding and printed electronic applications. - Electroninks says the platform is intended to help manufacturers improve performance while simplifying manufacturing workflows. - More information on Electroninks products and solutions is available here.

Between the lines: - The TechBlick appearance gives Electroninks a platform to frame MOD inks as a materials upgrade rather than a niche formulation change. - The focus on cost, process temperature and silver usage suggests the pitch is aimed at manufacturers balancing performance gains with supply-chain and production pressure. - The event also signals that conductive inks remain an active area of competition as electronics makers look for ways to reduce complexity in packaging and printed systems.

What’s next: - Attendees at TechBlick 2026 can hear the session in person on June 10 and speak with the Electroninks team at Booth E07. - Electroninks is expected to continue promoting its conductive ink portfolio across advanced packaging and printed electronics markets. - Interested readers can learn more through the company’s website and event presence at TechBlick.