3D IC and 2.5D IC packaging market to reach $94.76B by 2030

The Business Research Company says the global market for 3D IC and 2.5D IC packaging will rise from $63.82 billion in 2026 to $94.76 billion by 2030, driven by demand for high-bandwidth computing, chiplets and advanced packaging. Asia-Pacific led the market in 2025 and is expected to remain the fastest-growing region. Why it matters: - Advanced packaging is becoming a core enabler for smaller, faster electronics and higher-performance computing. - The market’s growth signals rising demand for chip stacking, interposers and heterogeneous integration across consumer devices and data-intensive applications. What happened: - The Business Research Company released a 2026 report on the global 3D IC and 2.5D IC packaging market. - The market is projected to grow from $58.17 billion in 2025 to $63.82 billion in 2026, a 9.7% CAGR. - The market is forecast to reach $94.76 billion by 2030, growing at a 10.4% CAGR. - The report covers Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, the Middle East and Africa. - Download a free sample of the market report - View the full market report The details: - 3D IC packaging stacks integrated circuits vertically to increase interconnect density and shorten connections between chips. - 2.5D IC packaging places chips side-by-side on an interposer, usually silicon, to support high-speed communication. - Early market growth came from R&D in 3D IC technologies, wider use of interposer-based packaging, continued reliance on traditional packaging methods, more memory-on-logic integration and demand for compact consumer electronics. - Future growth is expected to come from high-bandwidth computing, heterogeneous integration, advanced packaging capacity, chiplet architectures and ultra-high-density interposers. - The report highlights AI-driven chip stacking optimization, automation of 3D/2.5D packaging lines, intelligent interconnect monitoring, IoT-enabled semiconductor packaging and robotic precision assembly as emerging trends. - In May 2023, the Japan Electronics and Information Technology Industries Association said Japan’s electronic equipment production reached 771,457 million yen, about $5.6 billion. - Consumer electronics output in Japan rose to 32,099 million yen, about $233 million, from 25,268 million yen, about $183 million, in May 2022. - Asia-Pacific was the largest regional market in 2025 and is expected to be the fastest-growing region through the forecast period. - The 2026 report adds market attractiveness scoring, TAM analysis, company scoring matrix graphics and tables, Excel-based dashboards, market hotspots infographics, and updated technology and trend analysis. Between the lines: - The forecast points to packaging, not just chip design, as a strategic battleground for performance gains. - The emphasis on chiplets and heterogeneous integration reflects a shift toward modular semiconductor architectures that can scale more efficiently than monolithic designs. - Consumer electronics demand remains a useful proxy for how advanced packaging adoption spreads from premium devices into broader device categories. What’s next: - Market growth will likely track investment in advanced packaging manufacturing and high-density interposer capacity. - Adoption should expand as AI, gaming, remote work and data-heavy applications continue to raise performance demands. - The report’s regional breakdown suggests Asia-Pacific will remain the main center of growth and manufacturing activity. The bottom line: - 3D IC and 2.5D IC packaging is moving from niche advanced packaging toward mainstream semiconductor infrastructure, with strong growth expected through 2030.